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  ? semiconductor components industries, llc, 2013 june, 2013 ? rev. 0 1 publication order number: NB3L02/d NB3L02 2.8 v, high precision 1:2 clock fanout buffer description the NB3L02 is a low ? skew, low jitter 1:2 clock fanout buffer, ideal for use in portable end ? equipment, such as mobile phones or tablet applications. the mclk_in pin has an integrated ac coupling capacitor and will directly accept a square or sine wave clock input, such as a temperature compensated crystal oscillator (tcxo). the minimum acceptable input amplitude of the sine wave is 800 mv peak ? to ? peak. the NB3L02 is offered in a 0.4 mm pitch 6 ? ball, wafer ? level chip ? scale package (wlcsp) (0.77 mm x 1.17 mm). features ? 800 mv single ended outputs ? low phase noise: ? 144 dbc/hz @ 10 khz offset ? ultra small package: 0.4 mm pitch wlcsp6 (0.77 mm x 1.17 mm) ? exceeds jedec esd standards: 4000 v hbm, 200 v mm ? industrial t emperature range: ? 40 c to +85 c ? these are pb ? free devices pin descriptions ball no. name i/o description a1 v dd i power supply voltage a2 clk_out1 o clock output 1 b1 mclk_in i master clock input b2 gnd ? ground c1 gnd ? ground c2 clk_out2 o clock output 2 marking diagram wlcsp6 fc suffix case 567hj see detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. ordering information http://onsemi.com http://onsemi.com pinout diagram l2 = specific device code m = date code  = pb ? free package l2m  figure 1. simplified block diagram
NB3L02 http://onsemi.com 2 table 1. maximum ratings symbol parameter condition min max unit voltage range (note 1) mclk_in,clk_out1, clk_out2 -0.3 v dd + 0.3 v io continuous output current clk_out1/2 20 ma t j operating junction temperature range ? 40 150 c t stg storage temperature range ? 55 150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. all voltage values are with respect to network ground terminal. table 2. attributes characteristic value esd protection human body model >4 kv machine model >200 v moisture sensitivity wlcsp6 level 1 maximum soldering temperature for lead ? free devices using a lead ? free solder paste 260 flammability rating oxygen index: 28 to 34 ul 94 v ? 0 @ 0.125 in transistor count 149 meets or exceeds jedec spec eia/jesd78 ic latchup test ii table 3. electrical characteristics (t a = ? 40 c to +85 c) symbol characteristic min typ max unit v dd supply voltage 2.3 2.8 3.465 v v in input voltage p-p 800 v dd mv v out output voltage p-p 0.6 0.8 1.0 v i dddynamic dynamic current at 26 mhz 3.5 5 ma f in mclk_in frequency range with 800 mv input p ? p 10 26 52 mhz t pd mclk_in to clk_out_n propagation delay, input = 1 vp ? p @ 26 mhz 2.0 4.0 6.5 ns dc clk_out_n duty cycle 45 50 55 % ? phase noise, f in = 26 mhz, input t r /t f < 1 ns 1 khz offset 10 khz offset 100 khz offset ? 134 ? 144 ? 148 dbc/hz dbc/hz dbc/hz t r /t f output rise time 20%-80% with 10 pf load, v in = 800 mvp ? p, 26 mhz, input slew rate < 1 ns/v 0.5 0.8 1.2 ns t sk channel to channel skew 10 30 ps v oh high level output (v oh ? v ol not to exceed v out ) 0.6 0.8 1.0 v v ol low level output (v oh ? v ol not to exceed v out ) 0 v
NB3L02 http://onsemi.com 3 figure 2. typical phase noise ordering information device package shipping ? NB3L02fct2g wlcsp6 (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
NB3L02 http://onsemi.com 4 package dimensions wlcsp6, 1.17x0.77 case 567hj issue o seating plane 0.10 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max ??? millimeters a1 d 0.77 bsc e b 0.21 0.25 e 0.40 bsc 0.50 d e a b pin a1 reference e a 0.05 b c 0.03 c 0.05 c 6x b 12 c b a 0.10 c a a1 c 0.13 0.17 1.17 bsc pitch 0.23 6x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.40 0.40 0.10 c 2x top view side view bottom view note 3 recommended a1 package outline e pitch 6x e/2 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 NB3L02/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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